Kev tsim kho vajtse ntawm lub tshuab tsav tsheb chips yuav tsum tau ua tib zoo xav txog PCB layout thiab kub dissipation. Cov phaj hlau nyob hauv qab ntawm cov nti yuav tsum tau txias ntawm PCB. Lub qhov rais tooj liab (npog Ntau dua lossis sib npaug li 80% ntawm cov nti hauv qab cheeb tsam) yuav tsum tau tsim nyob rau hauv lub nti, txuas ntau lub vias mus rau thaj chaw tooj liab nyob tom qab. Lub cev muaj zog tus pin kab qhov dav yuav tsum siab dua lossis sib npaug li 2 hli (35µm tooj liab tuab), thiab lub zog tus pin kab kab dav yuav tsum siab dua lossis sib npaug li 3 hli. High-tam sim no txoj kev routing, thermal ncoo thiab los ntawm kev tsim, thiab kev siv qhov chaw-txuag thermally txhim khu tej pob khoom los yog reflow soldering rau ntawm -board tshav kub dissipation yog ib qho tseem ceeb heev.
Kev tiv thaiv kev tsim hluav taws xob yog qhov tseem ceeb los ua kom ntseeg tau tias kev ua haujlwm nti. Nws yuav tsum suav nrog tsib tus kheej- kev tiv thaiv thiab kev kuaj xyuas lub luag haujlwm: kev tiv thaiv undervoltage, tsav tam sim no txwv, siab - kub ceeb toom thiab tiv thaiv, ntsuas tam sim no, thiab luv luv- tiv thaiv Circuit Court. Feem ntau ua tau-hauv cov txheej txheem tiv thaiv nti suav nrog kev kaw qhov hluav taws xob qis (UVLO), kev tiv thaiv overcurrent (OCP), kev tiv thaiv overheat (TSD), thiab kev kwv yees kev saib xyuas kev ua haujlwm.
Lub cev muaj zog tsav, raws li qhov tseem ceeb ntawm kev cuam tshuam, ua rau muaj kev sib tw electromagnetic compatibility (EMC). Txo qhov hloov pauv ceev tuaj yeem txo qhov siab - zaus ntawm cov teeb liab, uas tuaj yeem ua tiav los ntawm kev kho tus nqi IDRIVE lossis slew. Kev ntsuas kev ua kom zoo suav nrog kev ua kom zoo lossis cuam tshuam kev sib kis spectrum ua haujlwm ntawm qee cov chips kom tawg ruaj khov- lub zog zaus, ntxiv cov lim dej (xws li PI lim), siv cov khoom siv decoupling raws li cov khoom siv hauv zos, thiab twisting ob lub xov hlau tawm ntawm DC lub cev muaj zog ua ke thiab ntxiv lub nplhaib sib nqus.
Ib qho tseem ceeb hauv kev hais txog kev tsim qauv tsis yooj yim thiab nrhiav kev ua haujlwm me me thiab kev txawj ntse yog kev sib koom ua ke siab, xws li kev sib koom ua ke MCUs, lub rooj tsav tsheb, lub zog MOSFETs, thiab txawm tias algorithms rau hauv ib lub nti lossis module (xws li lub zog ntse module, IPM). Tshwj xeeb, qhov no tshwm sim raws li kev sib txuas ntawm lub cev muaj zog tswj nti (MCU/ASIC), lub cev muaj zog tsav nti (HVIC), thiab cov khoom siv hluav taws xob (MOSFETs) rau hauv ob-hauv-ib lossis txawm peb-hauv-ib qho kev txawj ntse fais fab module (IPM), lossis kev sib koom ua ke ntawm 16-ntsis CPU KB 2 KB lub cim xeeb, thiab 3-ntsis CPU KB flashes, MLX81339, thiab nruab nrog ib tug configurable 3-theem tsav tsheb.
